Thermal Gap Filler  is composed of ceramic oxide thermal conductivity powder and organic elastic silicon adhesive, which is an excellent thermal conductivity composite filling material with low compression force, low thermal resistance, super soft performance and rebound resilience, also easy to operate and die cutting , It has high thermal performance and excellent thermal reliability. It can also achieve low interfacial thermal resistance under relatively low pressure. that can effectively eliminate air and achieve good filling effect Thermal silicon film has good insulation resistance to pressure and flame retardant properties,  which make it safe and reliable for application.